The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Sep. 14, 2023
Applicant:
Basf SE, Ludwigshafen am Rhein, DE;
Inventors:
Haci Osman Guevenc, Ludwigshafen am Rhein, DE;
Michael Lauter, Ludwigshafen am Rhein, DE;
Te Yu Wei, Taoyuan, TW;
Wei Lan Chiu, Taipei, TW;
Reza M. Golzarian, Portland, OR (US);
Julian Proelss, Allschwil, CH;
Leonardus Leunissen, Veldhoven, NL;
Assignee:
BASF SE, Ludwigshafen am Rhein, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1463 (2013.01); H01L 21/3212 (2013.01);
Abstract
The presently claimed invention relates to a chemical-mechanical polishing (CMP) composition and chemical-mechanical polishing (CMP) methods. The presently claimed invention particularly relates to a composition and process for chemical-mechanical polishing of substrates containing copper and ruthenium, specifically, semiconductor substrates containing copper and ruthenium.