The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Sep. 22, 2021
Intel Corporation, Santa Clara, CA (US);
Benjamin Duong, Chandler, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Helme A. Castro De La Torre, Gilbert, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Darko Grujicic, Chandler, AZ (US);
Sashi S. Kandanur, Phoenix, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Rengarajan Shanmugam, Chandler, AZ (US);
Thomas L. Sounart, Chandler, AZ (US);
Marcel Wall, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques directed to embedding capacitors in through glass vias within a glass core of a substrate. In embodiments, the through glass vias may extend entirely from a first side of the glass core to a second side of the glass core opposite the first side. Layers of electrically conductive material and dielectric material may then be deposited within the through glass via to form a capacitor. the capacitor may then be electrically coupled with electrical routings on buildup layers on either side of the glass core. Other embodiments may be described and/or claimed.