The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Aug. 03, 2021
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Shih-Hung Tsai, Tainan, TW;

Hon-Huei Liu, Kaohsiung, TW;

Chun-Hsien Lin, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/059 (2013.01); H03H 3/08 (2013.01); H03H 9/02559 (2013.01);
Abstract

A method for fabricating a surface acoustic wave (SAW) device includes the steps of forming a first dielectric layer on a substrate, forming a piezoelectric layer on the first dielectric layer, forming a second dielectric layer on the piezoelectric layer, performing a photo-etching process to remove the second dielectric layer for forming a recess in the second dielectric layer, forming a metal layer in the recess, and then performing a planarizing process to remove the metal layer for forming an electrode in the recess.


Find Patent Forward Citations

Tsai, Shih-Hung. (2025). Surface acoustic wave device and method for fabricating the same (U.S. Patent No. 12348214). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12348214

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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