The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Dec. 05, 2022
Applicant:

China Electronics Reliability and Environmental Testing Institute, Guangzhou, CN;

Inventors:

Chao Pang, Guangzhou, CN;

Yiqiang Ni, Guangzhou, CN;

Liang He, Guangzhou, CN;

Shizheng Yang, Guangzhou, CN;

Yinle Li, Guangzhou, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 25/72 (2006.01); G05B 23/02 (2006.01); G06T 15/08 (2011.01); H01L 23/00 (2006.01); H04N 23/23 (2023.01); H10D 88/00 (2025.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
G06T 7/0008 (2013.01); G01N 25/72 (2013.01); G05B 23/0256 (2013.01); G05B 23/0275 (2013.01); G06T 7/00 (2013.01); G06T 7/0002 (2013.01); G06T 15/08 (2013.01); H01L 24/95 (2013.01); H04N 23/23 (2023.01); H10D 88/00 (2025.01); G05B 2219/31356 (2013.01); G06T 2200/04 (2013.01); G06T 2207/30148 (2013.01); G06T 2211/461 (2023.08); H01L 25/0657 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/05001 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48145 (2013.01); H01L 2225/06503 (2013.01); H01L 2924/14 (2013.01);
Abstract

A method for fault isolation includes: acquiring a thermal imaging picture of a surface of a to-be-tested chip, the thermal imaging picture being obtained by scanning the to-be-tested chip to which a test signal is applied through an infrared thermal imaging device, and analyzing the thermal imaging picture to obtain a phase angle of each point on the surface of the to-be-tested chip; acquiring a three-dimensional image of the surface of the to-be-tested chip, the three-dimensional image being obtained by scanning the to-be-tested chip to which the test signal is applied through an image scanning device, and analyzing the three-dimensional image to obtain a three-dimensional coordinate of each point on the surface of the to-be-tested chip; calculating a three-dimensional coordinate of the fault in the to-be-tested chip according to the phase angle and the three-dimensional coordinate of each point on the surface of the to-be-tested chip.


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