The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Feb. 07, 2022
Ebara Corporation, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
In a plating apparatus including a shielding member, an ionically resistive element is disposed to be close to a surface to be plated of a substrate to improve uniformity of a distribution of plating film-thickness. A plating apparatus includes: a plating tankconfigured to house a plating solution; a substrate holderconfigured to hold a substrate Wf with a surface to be plated Wf-a facing downward; an anodedisposed in the plating tank; an ionically resistive elementdisposed between the substrate Wf and the anodeand including an opposed surface-opposed to the surface to be plated Wf-a, the opposed surface-including a first opposed surface-and a second opposed surface-apart from the surface to be plated Wf-a more than the first opposed surface-; and a shielding memberdisposed in a depressed region β of the ionically resistive element, the depressed region β being formed by the second opposed surface-. The shielding memberis for shielding an electric field.