The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Mar. 10, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
H. Jim Fulford, Albany, NY (US);
Mark I. Gardner, Albany, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/63 (2025.01); H10D 30/01 (2025.01); H10D 30/67 (2025.01); H10D 62/17 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01); H10D 88/00 (2025.01);
U.S. Cl.
CPC ...
H10D 30/63 (2025.01); H10D 30/025 (2025.01); H10D 30/6728 (2025.01); H10D 62/292 (2025.01); H10D 84/016 (2025.01); H10D 84/0172 (2025.01); H10D 84/0186 (2025.01); H10D 84/0195 (2025.01); H10D 84/038 (2025.01); H10D 84/85 (2025.01); H10D 88/00 (2025.01); H10D 88/01 (2025.01);
Abstract
Systems and methods for manufacturing semiconductor devices. The system can include a semiconductor device. The semiconductor device can include a semiconductor shell that extends along a vertical direction. The semiconductor device can include a first metal structure surrounded by a lower portion of the semiconductor shell. The semiconductor device can include a dielectric structure above the first metal structure. The semiconductor device can include a second metal structure through the dielectric structure.