The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Apr. 28, 2022
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Erh-Kun Lai, Taichung, TW;

Feng-Min Lee, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); H01L 23/535 (2006.01); H10B 41/27 (2023.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H01L 23/535 (2013.01); H10B 41/27 (2023.02);
Abstract

An integrated circuit structure includes a substrate, an interconnect stack, a first memory array, and a source line. The interconnect stack is over the substrate. The first memory array is over the interconnect stack and includes memory elements stacked in a vertical direction each comprising a conductive layer. The first memory array further includes a memory layer electrically connecting to the conductive layers of the memory elements and extending downwardly from a topmost one of the conductive layers to a lowermost one of the conductive layers; and a channel layer extending along a sidewall of the memory layer. The source line is in contact with a top end of the channel layer and laterally extends across the first memory array.


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