The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Oct. 11, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Koichi Motoyama, Clifton Park, NY (US);
Chanro Park, Clifton Park, NY (US);
Kenneth Chun Kuen Cheng, Shatin, HK;
Chih-Chao Yang, Glenmont, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 23/5283 (2013.01);
Abstract
A copper interconnect with self-aligned hourglass-shaped metal cap comprises a plurality of interconnect lines formed in a dielectric layer of a semiconductor device. The copper interconnect further comprises a metal cap formed on top of each interconnect line of the plurality of interconnect lines, where the metal cap is formed with self-aligning concave sides extending from a top surface of the dielectric layer to a top surface of the metal cap.