The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Feb. 04, 2022
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Wei-Hui Hsu, Singapore, SG;

Curtis Chun-I Hsieh, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 23/5222 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01);
Abstract

The semiconductor device includes an air gap extending through at least two metal layers. A dielectric lining layer is used on sidewalls of the opening to ensure a uniform width and protect certain cap layers during enlargement of the opening used to form the air gap. The air gap includes remnants of the dielectric lining layer on sidewalls of the air gap. The air gap reduces the capacitance between a transistor gate in a device layer and adjacent wires and vias used to contact the source and drain of the transistor, compared to air gaps in just a single metal layer or stacked air gaps in different layers.


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