The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Jun. 09, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Q-Han Park, Seoul, KR;
Sung Yoon Ryu, Seoul, KR;
Seunghyeok Son, Suwon-si, KR;
Sujin Lee, Gwangmyeong-si, KR;
Chan Gi Jeon, Hwaseong-si, KR;
Su-Hyun Gong, Seoul, KR;
DongGun Lee, Seoul, KR;
Younghoon Sohn, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, Seoul, KR;
Abstract
A semiconductor wafer inspection method is provided. The semiconductor wafer inspection method includes: providing a wafer with target and reference dies; obtaining a candidate image of a first region of the target die and a reference image of a second region of the reference die; performing an imaging process on the candidate image to obtain a high resolution candidate image including sub-pixels for each pixel of the candidate image; performing the imaging process on the reference image to obtain a high resolution reference image including sub-pixels for each pixel of the candidate image; shifting the high resolution reference image in units of the sub-pixels; obtaining a difference image based on a difference between the high resolution candidate image and the high resolution reference image; and detecting whether a defect signal generated based on the difference image exceeds a threshold value.