The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jan. 31, 2022
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masashi Shimoyama, Tokyo, JP;

Yasuyuki Masuda, Tokyo, JP;

Ryosuke Hiwatashi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
C25D 17/008 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01);
Abstract

A specific portion of a substrate is allowed to be shielded at a desired timing, and making a plating film-thickness uniform is improved. A plating module includes: a plating tankfor housing a plating solution; an anodedisposed in the plating tank; a substrate holderfor holding a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanismconfigured to rotate the substrate holderin a first direction and a second direction opposite to the first direction; and a shielding mechanismconfigured to move a shielding memberinto between the anodeand the substrate Wf depending on a rotation angle of the substrate holder


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