The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Jul. 07, 2022
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/033 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/0332 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 23/5226 (2013.01);
Abstract
Methods for formation of a layer stack during a back-end-of-line (BEOL) process flow and the layer stack formed therefrom are provided. In one or more embodiments, the method utilizes a two-dimensional (2D) self-aligned scheme with a subtractive metal etch. The method includes using a hard mask to form a via with a small width which is formed through or contacts each of a first metal layer and a second metal layer. The via is filled with a metal gapfill to connect the first metal layer and the second metal layer. Each of the first metal layer and the second metal layer are patterned to form a plurality of features.