The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Jun. 20, 2022
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Juanjuan Huang, Hefei, CN;

Yi Jiang, Hefei, CN;

Weiping Bai, Hefei, CN;

Deyuan Xiao, Hefei, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/05 (2023.02); H10B 12/30 (2023.02);
Abstract

A method for forming a memory includes the following operations: a substrate and a semiconductor layer located on the substrate are formed; the semiconductor layer is patterned to form a plurality of first isolation structures and channel regions, each first isolation structure includes a first through hole and a second through hole, and a first isolation pillar located between the first through hole and the second through hole; a first filling layer filling up the first through hole and the second through hole is formed; the first isolation pillar is removed to form a third through hole located in the first filling layer; a barrier layer filling up the third through hole is formed; the channel regions are exposed by removing the first filling layer; and a gate layer covering surfaces of the channel regions is formed.


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