The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Mar. 10, 2022
United Microelectronics Corp., Hsin-Chu, TW;
Chia-Chen Sun, Kaohsiung, TW;
En-Chiuan Liou, Tainan, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Abstract
A die seal ring structure includes a metal interconnect structure on a substrate, in which the metal interconnect structure includes an inter-metal dielectric (IMD) layer on the substrate and a first metal interconnection disposed in the IMD layer. Preferably, a first side of the first metal interconnection includes a comb-shape portion in a top view, a second side of the first metal interconnection includes a linear line, a third side of the first metal interconnection includes a linear line, and a fourth side of the first metal interconnection includes a linear line.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile