The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Jul. 06, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hanish Kumar Panavalappil Kumarankutty, Bengaluru, IN;

Sean M. Seutter, San Jose, CA (US);

Sudhir R. Gondhalekar, Pleasanton, CA (US);

Wendell Glenn Boyd, Jr., Morgan Hill, CA (US);

Badri Ramamurthi, Los Gatos, CA (US);

Shekhar Athani, Bangalore, IN;

Anil Kumar Kalal, Bangalore, IN;

Jay Dee Pinson, Ii, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01J 37/32724 (2013.01); H01L 21/67248 (2013.01); H01L 21/6875 (2013.01); H01J 2237/2007 (2013.01);
Abstract

Embodiments of the disclosure provide electrostatic chucks for securing substrates during processing. Some embodiments of this disclosure provide methods and apparatus for increased temperature control across the radial profile of the substrate. Some embodiments of the disclosure provide methods and apparatus for providing control of hydrogen concentration in processed films during a high-density plasma (HDP) process.


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