The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Jan. 05, 2021
Applicant:

Echem Solutions Corp., Taoyuan, TW;

Inventors:

Tz-Jin Yang, Taoyuan, TW;

Yung-Yu Lin, Taoyuan, TW;

Chi-Yu Lai, Taoyuan, TW;

Ming-Che Chung, Taoyuan, TW;

Che-Wei Chang, Taoyuan, TW;

Assignee:

eChem Solutions Corp., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); C08G 69/26 (2006.01); C08G 73/10 (2006.01); C08G 73/26 (2006.01); G03F 7/00 (2006.01); G03F 7/037 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/30 (2006.01); G03F 7/34 (2006.01); G03F 7/42 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08G 69/26 (2013.01); C08G 69/265 (2013.01); C08G 73/10 (2013.01); G03F 7/0002 (2013.01); G03F 7/037 (2013.01); G03F 7/0382 (2013.01); G03F 7/30 (2013.01); G03F 7/343 (2013.01); G03F 7/42 (2013.01);
Abstract

A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer having a first surface and a second surface opposite to each other, wherein the first surface of the release layer is in contact with the substrate; forming a photoresist layer on the second surface of the release layer; and removing the release layer and the photoresist layer. The release layer is formed by a polyimide resin. The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines. The diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes.


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