The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

May. 12, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Oscar Van Der Straten, Guilderland Center, NY (US);

Koichi Motoyama, Clifton Park, NY (US);

Joseph F. Maniscalco, Lake Katrine, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 50/80 (2023.01); H10B 61/00 (2023.01); H10N 50/01 (2023.01);
U.S. Cl.
CPC ...
H10N 50/80 (2023.02); H10B 61/00 (2023.02); H10N 50/01 (2023.02);
Abstract

A semiconductor structure may include a pyramidal magnetic tunnel junction on top of a bottom electrode, a tunnel layer on top and in electrical contact with the first magnetic layer, a second magnetic layer on top and in electrical contact with the tunnel layer, and a hard mask cap on top of the second magnetic layer. The pyramidal magnetic tunnel junction may have a first magnetic layer on top and in electrical contact with the bottom electrode. The semiconductor structure may include a first encapsulation spacer positioned along vertical sidewalls of the hard mask cap, a second encapsulation spacer positioned along vertical sidewalls of the second magnetic layer, a third encapsulation spacer positioned along vertical sidewalls of the tunnel layer, and a fourth encapsulation spacer positioned along vertical sidewalls of the first magnetic layer.


Find Patent Forward Citations

Van Der Straten, Oscar. (2025). Mram structure with multilayer encapsulation (U.S. Patent No. 12317752). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12317752

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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