The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Aug. 09, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Dechao Guo, Niskayuna, NY (US);

Junli Wang, Slingerlands, NY (US);

Alexander Reznicek, Troy, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/00 (2025.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6219 (2025.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 64/01 (2025.01); H10D 64/017 (2025.01);
Abstract

A semiconductor device is provided that includes a local passthrough interconnect structure present in a non-active device region of the device. A dielectric fill material structure is located between the local passthrough interconnect structure and a functional gate structure that is present in an active device region that is laterally adjacent to the non-active device region. The semiconductor device has reduced capacitance (and thus circuit speed is not compromised) as compared to an equivalent device in which a metal-containing sacrificial gate structure is used instead of the dielectric fill material structure.


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