The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Jun. 21, 2024
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/44 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3288 (2013.01); C23C 16/4404 (2013.01); C23C 16/4405 (2013.01); H01J 37/32082 (2013.01); H01J 37/32449 (2013.01); H01J 37/32477 (2013.01); H01J 37/32715 (2013.01); H01J 37/32862 (2013.01); H01L 21/67063 (2013.01); H01L 21/67098 (2013.01); H01L 21/67248 (2013.01);
Abstract
A method of performing maintenance on a substrate processing apparatus is provided. The substrate processing apparatus includes a chamber and a gas supplier configured to supply a processing gas to an interior of the chamber. The method includes (a) supplying a first processing gas from the gas supplier to the interior of the chamber, and forming a protective film on a surface of a member in the interior of the chamber, and (b) after (a), exposing the interior of the chamber to an ambient environment and performing the maintenance on the substrate processing apparatus.