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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12308275 B1

PDFFull Text
Date of Patent:
May. 20, 2025

Filed:

Jun. 10, 2024

Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place

Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Sidlgata V. Sreenivasan, Austin, TX (US);

Paras Ajay, Austin, TX (US);

Aseem Sayal, Austin, TX (US);

Mark McDermott, Austin, TX (US);

Shrawan Singhal, Austin, TX (US);

Ovadia Abed, Austin, TX (US);

Lawrence Dunn, Austin, TX (US);

Vipul Goyal, Austin, TX (US);

Michael Cullinan, Austin, TX (US);

Assignee:

Board of Regents, The University of Texas System, Austin, TX (US);

Attorneys:

Robert A. Voigt, Jr.

Shackelford, McKinley & Norton, LLP

Primary Examiner:

Robert G Bachner

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B81C 99/00 (2010.01); G06F 30/392 (2020.01); G06F 30/396 (2020.01); G06F 30/398 (2020.01); G06F 117/10 (2020.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B81C 99/002 (2013.01); G06F 30/392 (2020.01); G06F 30/396 (2020.01); G06F 30/398 (2020.01); H01L 21/6838 (2013.01); H01L 23/544 (2013.01); G06F 2117/10 (2020.01); H01L 2221/68309 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54473 (2013.01);
Abstract

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Find Patent Forward Citations

Sreenivasan, Sidlgata. (2025). Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place (U.S. Patent No. 12308275). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12308275

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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