The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Jan. 25, 2021
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Anirvan Sircar, Beaverton, OR (US);

Fayaz A. Shaikh, Lake Oswego, OR (US);

Kevin M. McLaughlin, Sherwood, OR (US);

Alexander Ray Fox, Portland, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/04 (2006.01); C23C 16/34 (2006.01); C23C 16/505 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02348 (2013.01); C23C 16/042 (2013.01); C23C 16/345 (2013.01); C23C 16/505 (2013.01); H01L 21/0217 (2013.01); H01L 22/20 (2013.01);
Abstract

Localized stresses can be modulated in a film deposited on a bowed semiconductor substrate by selectively and locally curing the film by ultraviolet (UV) radiation. A bowed semiconductor substrate can be asymmetrically bowed. A UV-curable film is deposited on the front side or the backside of the bowed semiconductor substrate. A mask is provided between the UV-curable film and a UV source, where openings in the mask are patterned to selectively define exposed regions and non-exposed regions of the UV-curable film. Exposed regions of the UV-curable film modulate localized stresses to mitigate bowing in the bowed semiconductor substrate.


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