The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Dec. 07, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chen-Yu Liu, Kaohsiung, TW;

Tzu-Yang Lin, Tainan, TW;

Ya-Ching Chang, Hsinchu, TW;

Ching-Yu Chang, Yilang County, TW;

Chin-Hsiang Lin, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2005.12); G03F 7/075 (2005.12); G03F 7/16 (2005.12); G03F 7/20 (2005.12); H01L 21/02 (2005.12); H01L 21/027 (2005.12); H01L 29/10 (2005.12); H01L 29/66 (2005.12); H01L 29/78 (2005.12);
U.S. Cl.
CPC ...
G03F 7/11 (2012.12); G03F 7/0751 (2012.12); G03F 7/162 (2012.12); G03F 7/20 (2012.12); H01L 21/02118 (2012.12); H01L 21/02282 (2012.12); H01L 21/0276 (2012.12); H01L 29/1054 (2012.12); H01L 29/66795 (2012.12); H01L 29/785 (2012.12);
Abstract

A method is provided including forming a first layer over a substrate and forming an adhesion layer over the first layer. The adhesion layer has a composition including an epoxy group. A photoresist layer is formed directly on the adhesion layer. A portion of the photoresist layer is exposed to a radiation source. The composition of the adhesion layer and the exposed portion of the photoresist layer cross-link using the epoxy group. Thee photoresist layer is then developed (e.g., by a negative tone developer) to form a photoresist pattern feature, which may overlie the formed cross-linked region.


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