The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Jul. 21, 2021
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Chih Tung Yeh, Taoyuan, TW;

Wen-Jung Liao, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/00 (2024.12); H01L 21/02 (2005.12); H10D 30/01 (2024.12); H10D 30/47 (2024.12); H10D 62/824 (2024.12); H10D 62/85 (2024.12);
U.S. Cl.
CPC ...
H10D 64/118 (2024.12); H01L 21/02164 (2012.12); H01L 21/0217 (2012.12); H01L 21/02178 (2012.12); H10D 30/015 (2024.12); H10D 30/475 (2024.12); H10D 62/824 (2024.12); H10D 62/8503 (2024.12);
Abstract

Provided are a nitride semiconductor device and a manufacturing method thereof. The nitride semiconductor device includes a substrate, a first nitride semiconductor layer, a second nitride semiconductor layer, a first metal layer, a second metal layer and a dielectric layer. The first nitride semiconductor layer is disposed on the substrate. The second nitride semiconductor layer is disposed on the first nitride semiconductor layer. The first metal layer is disposed in the second nitride semiconductor layer. The second metal layer is disposed on the second nitride semiconductor layer. The dielectric layer is disposed between the first metal layer and the second nitride semiconductor layer and/or between the second metal layer and the second nitride semiconductor layer.


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