The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Oct. 25, 2021
Nxp Usa, Inc., Austin, TX (US);
Michael B. Vincent, Chandler, AZ (US);
Giorgio Carluccio, Eindhoven, NL;
NXP USA, Inc., Austin, TX (US);
Abstract
A method of forming a semiconductor device is provided. The method includes providing a radiating element structure and a semiconductor die. The radiating element structure includes a non-conductive substrate, a radiating element formed at a top side of the non-conductive substrate, and a conductive ring formed at the top side of the non-conductive substrate substantially surrounding the radiating element. The semiconductor die is interconnected with the radiating element by way of a conductive trace. An encapsulant encapsulates at least a portion of the radiating element structure. A top surface of the conductive ring exposed at a top surface of the encapsulant. A waveguide interface material is applied on at least a portion of the top surface of the encapsulant.