The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Jul. 27, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Volume Chien, Tainan, TW;

Su-Hua Chang, Chiayi County, TW;

Chia-Yu Wei, Tainan, TW;

Zen-Fong Huang, Tainan, TW;

Chi-Cherng Jeng, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2005.12); H01L 31/0216 (2013.12);
U.S. Cl.
CPC ...
H01L 27/1464 (2012.12); H01L 27/14623 (2012.12); H01L 27/14627 (2012.12); H01L 27/14632 (2012.12); H01L 27/14687 (2012.12); H01L 31/02164 (2012.12);
Abstract

An image sensor includes a pixel array, a dielectric layer, a plurality of first conductive shielding regions, and a plurality of second conductive shielding regions. The pixel array includes photodiodes within a substrate. The dielectric layer is over the substrate. From a plan view, the first conductive shielding regions are adjacent four corners of the pixel array, and the second conductive shielding regions are adjacent four sides of the pixel array. The second conductive region has a length-to-width ratio greater than a length-to-width ratio of the first conductive region.


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