The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Feb. 07, 2022
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Sen Li, Hefei, CN;

Jun Xia, Hefei, CN;

Kangshu Zhan, Hefei, CN;

Tao Liu, Hefei, CN;

Qiang Wan, Hefei, CN;

Penghui Xu, Hefei, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2022.12); H01L 21/768 (2005.12);
U.S. Cl.
CPC ...
H10B 12/482 (2023.01); H01L 21/76814 (2012.12); H01L 21/76852 (2012.12);
Abstract

The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a substrate; a bit line located on the substrate; and a support layer located on the substrate, wherein the support layer includes a first support segment and a second support segment, the first support segment and the second support segment are both connected to the bit line, and the bit line is located between the first support segment and the second support segment.


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