The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

May. 16, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chien-Tai Chan, Hsinchu, TW;

Yu-Ching Huang, Taipei, TW;

Chien-Chih Lin, Taichung, TW;

Hsueh-Jen Yang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2005.12); H01L 29/08 (2005.12); H01L 29/66 (2005.12); H01L 29/786 (2005.12); H01L 29/06 (2005.12);
U.S. Cl.
CPC ...
H01L 29/0847 (2012.12); H01L 29/66545 (2012.12); H01L 29/66553 (2012.12); H01L 29/66742 (2012.12); H01L 29/78621 (2012.12); H01L 29/78696 (2012.12); H01L 29/0665 (2012.12); H01L 29/42392 (2012.12);
Abstract

A semiconductor device structure and a formation method are provided. The method includes forming a protruding structure over a substrate. The protruding structure has multiple sacrificial layers and multiple semiconductor layers, and the sacrificial layers and the semiconductor layers have an alternating configuration. The method also includes forming a gate stack to wrap a portion of the protruding structure. The method further includes forming an epitaxial structure abutting edges of the semiconductor layers. The formation of the epitaxial structure includes forming a lower semiconductor portion on a bottom of the recess and forming an upper semiconductor portion over the lower semiconductor portion. The upper semiconductor portion and the lower semiconductor portion are oppositely doped.


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