The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Feb. 12, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Philex Ming-Yan Fan, Hsinchu, TW;

Chia-En Huang, Hsinchu, TW;

Yih Wang, Hsinchu, TW;

Jonathan Tsung-Yung Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/04 (2005.12); G06F 1/20 (2005.12); G11C 7/22 (2005.12);
U.S. Cl.
CPC ...
G11C 7/04 (2012.12); G06F 1/206 (2012.12); G11C 7/22 (2012.12);
Abstract

A system includes a high bandwidth memory (HBM) arranged into portions including memory cells, the HBM further including a differentiated dynamic voltage and frequency scaling (DDVFS) device to perform the following: for a first set of one or more of the memory cells in a first one of the portions, the first set including a first one of the memory cells, controlling a temperature of the first set based on one or more first environmental signals corresponding to at least a first transistor in the first memory cell; and for a second set of one or more of the memory cells in a second one of the portions, the second set including a second one of memory cells, controlling a temperature of the second set based on one or more second environmental signals corresponding to at least a second transistor in the second memory cell.


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