The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Jul. 22, 2020
Applicants:

Shanghai Integrated Circuit Equipment & Materials Industry Innovation Center Co., Ltd., Shanghai, CN;

Shanghai Ic R&d Center Co., Ltd., Shanghai, CN;

Inventors:

Min Zhong, Shanghai, CN;

Ming Li, Shanghai, CN;

Shoumian Chen, Shanghai, CN;

Gaoming Feng, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 70/00 (2022.12); H10B 63/00 (2022.12); H10B 63/10 (2022.12); H10N 70/20 (2022.12);
U.S. Cl.
CPC ...
H10N 70/8413 (2023.01); H10B 63/10 (2023.01); H10B 63/20 (2023.01); H10N 70/023 (2023.01); H10N 70/066 (2023.01); H10N 70/231 (2023.01); H10N 70/8265 (2023.01);
Abstract

The present invention disclosures a phase change memory unit, wherein comprising from bottom to top: a bottom electrode, a heating electrode, a phase change unit and a top electrode, the phase change unit is a longitudinally arranged column, which comprises: a cylindrical selector layer, a circular barrier layer and a circular phase change material layer form inside to outside; wherein, the bottom electrode, the heating electrode and the circular phase change material layer are sequentially connected, and the selector layer is connected to the top electrode. The present invention using trench sidewall deposition or via filling, forming the cylindrical phase change unit which is a circular nested structure, which can improve reliability of a device, greatly reduce volume of a phase change operation area and heat energy required, thus heating efficiency is improved obviously, the power consumption of the device is reduced, and high-density storage is realized.


Find Patent Forward Citations

Loading…