The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Nov. 27, 2023
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Ming-Hua Chang, Tainan, TW;

Po-Wen Su, Kaohsiung, TW;

Chih-Tung Yeh, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/47 (2025.01); H01L 21/311 (2006.01); H10D 30/01 (2025.01); H10D 62/85 (2025.01);
U.S. Cl.
CPC ...
H10D 30/472 (2025.01); H01L 21/31116 (2013.01); H10D 30/015 (2025.01); H10D 62/8503 (2025.01);
Abstract

A method for forming a semiconductor structure includes the steps of forming a stacked structure on a substrate, forming an insulating layer on the stacked structure, forming a passivation layer on the insulating layer, performing an etching process to form an opening through the passivation layer and the insulating layer to expose a portion of the stacked structure and an extending portion of the insulating layer, and forming a contact structure filling the opening and directly contacting the stacked structure, wherein the extending portion of the insulating layer is adjacent to a surface of the stacked structure directly contacting the contact structure.


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