The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Jun. 20, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tsung-Han Tsai, Kaohsiung, TW;

Jen-Hsiang Lu, Taipei, TW;

Shih-Hsun Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42392 (2013.01); H01L 21/02359 (2013.01); H01L 29/401 (2013.01); H01L 29/66545 (2013.01); H01L 29/7851 (2013.01); H01L 29/78696 (2013.01);
Abstract

A semiconductor device structure is provided. The semiconductor device structure includes first and second gate spacers formed over a semiconductor substrate, longitudinally extending along a first direction, and separated from each other by a gate electrode layer. A first insulating layer longitudinally extends along a second direction to pass through the gate electrode layer and the first and second gate spacers. A gate dielectric layer has a top surface covered by the gate electrode layer. The top width of the gate dielectric layer is less than that of the gate electrode layer. The first and second gate spacers and the first insulating layer have first, second and third hydrophobic surfaces, respectively. These hydrophobic surfaces are in direct contact with first, second and third sidewall surfaces of the gate electrode layer, respectively.


Find Patent Forward Citations

Loading…