The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Dec. 10, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Prashant Majhi, San Jose, CA (US);

Derchang Kau, Cupertino, CA (US);

Max Hineman, Boise, ID (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); G11C 5/06 (2006.01); G11C 13/00 (2006.01); H01L 27/06 (2006.01); H10B 63/00 (2023.01); H10N 70/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
H10B 63/845 (2023.02); G11C 5/06 (2013.01); G11C 13/0002 (2013.01); H01L 27/0688 (2013.01); H10N 70/021 (2023.02); H10N 70/253 (2023.02); H10N 70/883 (2023.02);
Abstract

A memory device structure includes a vertical transistor having a channel between a source and a drain, a gate electrode adjacent the channel, where the gate electrode is in a first direction orthogonal to a longitudinal axis of the channel. A gate dielectric layer is between the gate electrode and the channel A first terminal of a first interconnect is coupled with the source or the drain, where the first interconnect is colinear with the longitudinal axis. The memory device structure further includes a pair of memory cells, where individual ones of the memory cells includes a selector and a memory element, where a first terminal of the individual ones of the memory cell is coupled to a respective second and a third terminal of the first interconnect. A second terminal of the individual ones of the memory cell is coupled to individual ones of the pair of second interconnects.


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