The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Jun. 25, 2021
Intel Corporation, Santa Clara, CA (US);
Georgios Dogiamis, Chandler, AZ (US);
Johanna Swan, Scottsdale, AZ (US);
Adel Elsherbini, Tempe, AZ (US);
Shawna Liff, Scottsdale, AZ (US);
Beomseok Choi, Chandler, AZ (US);
Qiang Yu, Saratoga, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes a waveguide interconnect to provide a communication channel to carry an electromagnetic signal. The waveguide interconnect is defined by a plurality of through substrate vias (TSVs). The TSVs in a pattern around the at least the portion of the substrate to define a boundary of the communication channel.