The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Feb. 11, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Che-Yu Lin, Hsinchu, TW;

Ming-Hua Yu, Hsinchu, TW;

Yee-Chia Yeo, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 21/02 (2006.01); H01L 29/04 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0847 (2013.01); H01L 21/0262 (2013.01); H01L 29/045 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 21/0245 (2013.01); H01L 21/02532 (2013.01); H01L 21/02609 (2013.01);
Abstract

A method includes forming a fin protruding from a substrate; forming an isolation region surrounding the fin; forming a gate structure extending over the fin and the isolation region; etching the fin adjacent the gate structure to form a recess; forming a source/drain region in the recess, including performing a first epitaxial process to grow a first semiconductor material in the recess, wherein the first epitaxial process preferentially forms facet planes of a first crystalline orientation; and performing a second epitaxial process to grow a second semiconductor material on the first semiconductor material, wherein the second epitaxial process preferentially forms facet planes of a second crystalline orientation, wherein a top surface of the second semiconductor material is above a top surface of the fin; and forming a source/drain contact on the source/drain region.


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