The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Sep. 28, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Tao Li, Slingerlands, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Tsung-Sheng Kang, Ballston Lake, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 23/53266 (2013.01);
Abstract

Embodiments of the invention include a method for fabricating a semiconductor device and the resulting structure. A metal line is formed on a bottom liner, a sacrificial hardmask on a top surface of the metal line. Portions of the sacrificial hardmask are selectively removed that that do not correspond a desired location of a top via. The remaining sacrificial hardmask is replaced with the top via, the top via and the metal line each tapered such that a width at each respective bottom surface is greater than a width of each respective top surface.


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