The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Aug. 30, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Huai Huang, Clifton Park, NY (US);

Hosadurga Shobha, Niskayuna, NY (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Chanro Park, Clifton Park, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32139 (2013.01); H01L 21/76885 (2013.01); H01L 23/5283 (2013.01); H01L 23/53257 (2013.01);
Abstract

A semiconductor structure comprising a substrate, a first metal layer on top of the substrate, a second metal layer on top of the first metal layer and a dielectric layer adjacent to the second metal layer and at least part of the first metal layer and on top of at least part of the first metal layer. The first metal layer includes a via. The width of the second metal layer is the same as the width of the via of the first metal layer.


Find Patent Forward Citations

Loading…