The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

May. 06, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Wei Peng, Hsinchu, TW;

Chih-Min Hsiao, Hsinchu, TW;

Jiann-Tyng Tzeng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4175 (2013.01); H01L 21/31144 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H01L 29/401 (2013.01);
Abstract

An integrated circuit includes a set of power rails, a set of active regions, a first set of conductive lines and a first and a second set of vias. The set of power rails is configured to supply a first or second supply voltage, and is on a first level of a back-side of a substrate. The set of active regions is a second level of a front-side of the substrate. The first set of conductive lines extend in a second direction and overlap the set of active regions. The first set of vias is between and electrically couples the set of active regions and the first set of conductive lines together. The second set of vias is between and electrically couples the first set of conductive lines and the set of power rails together.


Find Patent Forward Citations

Loading…