The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Jul. 26, 2022
Applicant:

Fei Company, Hillsboro, OR (US);

Inventors:

Thomas Gary Miller, Portland, OR (US);

Jason Arjavac, Hillsboro, OR (US);

Brian Routh, Jr., Beaverton, OR (US);

Mark Biedrzycki, Beaverton, OR (US);

Assignee:

FEI Company, Hillsboro, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/30 (2006.01); H01J 37/147 (2006.01); H01J 37/28 (2006.01); H01J 37/305 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3005 (2013.01); H01J 37/1478 (2013.01); H01J 37/28 (2013.01); H01J 37/3053 (2013.01); H01J 2237/30405 (2013.01);
Abstract

Methods and apparatus are disclosed for integration of image-based metrology into a milling workflow. A first ion beam milling operation is performed to an edge at a distance from a final target position on a sample. An SEM image of the sample is used to determine a distance between the milled edge and a reference structure on the sample. Based on the determined distance, the ion beam is adjusted to perform a second milling operation to shift the milled edge to the final target position. Extensions to iterative procedures are disclosed. Various geometric configurations and corrections are disclosed. Manufacturing and analytic applications are disclosed in a variety of fields, including read-write head manufacture and TEM sample preparation. Other combinations of imaging and milling tools can be used.


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