The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Jun. 29, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Jiun-Yi Wu, Taoyuan, TW;
Chien-Hsun Lee, Hsinchu County, TW;
Chewn-Pu Jou, Hsinchu, TW;
Fu-Lung Hsueh, Kaohsiung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
An interconnect structure includes a dielectric block, a first conductive plug, a second conductive plug, a substrate, a first conductive line, and a second conductive line. The first conductive plug and the second conductive plug are surrounded by the dielectric block. The substrate surrounds the dielectric block. The first conductive line is connected to the first conductive plug and is in contact with a top surface of the dielectric block. The second conductive line is connected to the second conductive plug.