The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Jun. 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Guo-Huei Wu, Tainan, TW;
Po-Chun Wang, Hsinchu, TW;
Hui-Zhong Zhuang, Kaohsiung, TW;
Chih-Liang Chen, Hsinchu, TW;
Li-Chun Tien, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
An integrated circuit is provided and includes first and second gates arranged in first and second layers, wherein the first and second gates extend in a first direction; a first insulating layer interposed between the first and second gates, wherein the first insulating layer, a first portion of the first gate, and a first portion of the second gate overlap with each other in a layout view; a cut layer, different from the first insulating layer, disposed on a second portion of the first gate; a first via passing through the cut layer and coupled to the second portion of the first gate; and a second via overlapping the first portion of the first gate and the first portion of the second gate, and coupled to the second gate. The first and second vias are configured to transmit different control signals to the first and second gates.