The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Aug. 03, 2023
Applicant:
Pdf Solutions, Inc., Santa Clara, CA (US);
Inventors:
Tomonori Honda, Santa Clara, CA (US);
Lin Lee Cheong, San Jose, CA (US);
Richard Burch, McKinney, TX (US);
Qing Zhu, Rowlett, TX (US);
Jeffrey Drue David, San Jose, CA (US);
Michael Keleher, Seattle, WA (US);
Assignee:
PDF Solutions, Inc., Santa Clara, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06V 10/74 (2022.01); G06F 11/07 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06F 11/079 (2013.01); G06T 2207/30148 (2013.01);
Abstract
A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.