The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Nov. 19, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Tomoharu Matsushita, Chiba, JP;

Aravind Kamath, San Jose, CA (US);

Jallepally Ravi, San Ramon, CA (US);

Cheng-Hsiung Tsai, Cupertino, CA (US);

Hiroyuki Takahama, Chiba-ken, JP;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 5/004 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); B25J 11/00 (2006.01);
U.S. Cl.
CPC ...
G01B 5/004 (2013.01); H01L 21/68 (2013.01); H01L 21/6838 (2013.01); B25J 11/0095 (2013.01);
Abstract

Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.


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