The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Nov. 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Peng-Cheng Hong, Taichung, TW;
Jun-Liang Pu, Hsin-Chu, TW;
W. L. Hsu, Hsin-Chu, TW;
Chung-Hao Kao, Hsin-Chu, TW;
Chia-Chun Hung, Taichung, TW;
Cheng-Yi Wu, Taichung, TW;
Chin-Szu Lee, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.