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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12218058 B1

PDFFull Text
Date of Patent:
Feb. 04, 2025

Filed:

Aug. 27, 2021

Integrated circuits having stacked transistors and backside power nodes

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chih-Yu Lai, Hsinchu, TW;

Chih-Liang Chen, Hsinchu, TW;

Li-Chun Tien, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham LLP

Primary Examiner:

Herve-Louis Y Assouman

Assistant Examiner:

Linda J. Fleck

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/02 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 21/02603 (2013.01); H01L 21/823807 (2013.01); H01L 21/823871 (2013.01); H01L 27/0922 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/66439 (2013.01); H01L 29/66742 (2013.01); H01L 29/775 (2013.01); H01L 29/78696 (2013.01);
Abstract

An integrated circuit device includes a first-type active-region semiconductor structure, a second-type active-region semiconductor structure stacked with the first-type active-region semiconductor structure, a front-side power rail in a front-side conductive layer, and a back-side power rail in a back-side conductive layer. The integrated circuit device also includes a source conductive segment intersecting the first-type active-region semiconductor structure at a source region of a transistor, a back-side power node in the back-side conductive layer, and a top-to-bottom via-connector. The source conductive segment is conductively connected to the front-side power rail through a front-side terminal via-connector. The top-to-bottom via-connector is connected between the source conductive segment and the back-side power node.

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