The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Jun. 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Te-Hsin Chiu, Hsinchu, TW;
Wei-An Lai, Hsinchu, TW;
Meng-Hung Shen, Hsinchu, TW;
Wei-Cheng Lin, Hsinchu, TW;
Jiann-Tyng Tzeng, Hsinchu, TW;
Kam-Tou Sio, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method for fabricating a semiconductor structure includes depositing a first insulation material over a substrate, wherein the substrate includes an active region. The method further includes etching the first insulation material to define a first recess extending along a first direction at a first level of the first insulation material. The method further includes depositing a second insulation material lining with a sidewall of the first recess. The method further includes depositing a first metal line in the first recess.