The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Jan. 22, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Lior Huli, Albany, NY (US);

Richard Farrell, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B81C 1/00 (2006.01); C08L 25/06 (2006.01); C08L 53/00 (2006.01); C09D 153/00 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B81C 1/00031 (2013.01); C08L 25/06 (2013.01); C08L 53/00 (2013.01); C09D 153/00 (2013.01); B81C 2201/0149 (2013.01); B82Y 40/00 (2013.01);
Abstract

A method for forming a device includes blending, in a mixer within a fabrication facility, a first liquid including a first block copolymer with a second liquid including a second block copolymer to form a first mixture. The first block copolymer includes a first homopolymer and a second homopolymer, where the first homopolymer has a first mole fraction in the first liquid. The second block copolymer includes the first homopolymer and the second homopolymer, the first homopolymer having a second mole fraction in the second liquid, the first mole fraction being different from the second mole fraction. The method includes placing a substrate over a substrate holder of a processing chamber within the fabrication facility; and coating the substrate with the first mixture within the processing chamber.


Find Patent Forward Citations

Loading…