The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Mar. 20, 2024
Applicant:

Celestial Ai Inc., Santa Clara, CA (US);

Inventors:

Philip Winterbottom, San Jose, CA (US);

David Lazovsky, Los Gatos, CA (US);

Ankur Aggarwal, Pleasanton, CA (US);

Martinus Bos, San Jose, CA (US);

Subal Sahni, La Jolla, CA (US);

Assignee:

Celestial AI Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/43 (2006.01); G02F 1/015 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4295 (2013.01); G02B 6/4246 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01); G02F 1/0157 (2021.01); G02B 6/4245 (2013.01);
Abstract

A package includes a first die with a bridging element with a first interconnect region, a first photonic transceiver portion, a second interconnect region, a first photonic path to an optical interface (OI), and a second photonic path from the OI to the first photonic transceiver portion. The first interconnect region electrically couples the first photonic transceiver portion to a second photonic transceiver portion in an analog/mixed-signal die (AMS die), while the second interconnect region connects a third photonic transceiver portion in a general die to the second photonic transceiver portion using an electrical coupling embedded in the first die. The electrical interconnects in the first interconnect region are less than two millimeters in length.


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