The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Nov. 24, 2021
Applicant:

Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventors:

Nicolas Posseme, Grenoble, FR;

Laurent Grenouillet, Grenoble, FR;

Olivier Pollet, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/02 (2006.01); C23F 4/00 (2006.01); H01J 37/32 (2006.01); H10B 63/00 (2023.01); H10N 70/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
C23F 1/02 (2013.01); C23F 4/00 (2013.01); H01J 37/32522 (2013.01); H10B 63/22 (2023.02); H10N 70/011 (2023.02); H10N 70/063 (2023.02); H10N 70/20 (2023.02); H10N 70/826 (2023.02); H10N 70/841 (2023.02); H10N 70/8833 (2023.02); H01J 2237/2001 (2013.01); H01J 2237/3341 (2013.01);
Abstract

A method for increasing the surface roughness of a layer based on a metal having a catalytic power, includes fixing fluorine or chlorine on the surface of the metal based layer, by exposing the metal based layer to a plasma formed from a reactive gas containing fluorine or chlorine; exposing the surface of the metal based layer to a humid environment to produce an acid, by reaction of hydrogen from the humid environment with the fluorine or the chlorine fixed on the surface of the metal based layer, the acid reacting with the metal to form residues, the whole of the residues forming a pattern on the surface of the metal based layer, and etching the metal based layer through the residues, so as to transfer the pattern into the metal based layer.


Find Patent Forward Citations

Loading…