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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12199012 B1

PDFFull Text
Date of Patent:
Jan. 14, 2025

Filed:

Jun. 26, 2020

Modular microchannel thermal solutions for integrated circuit devices

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Adel Elsherbini, Tempe, AZ (US);

Stephen Morein, Chandler, AZ (US);

Feras Eid, Chandler, AZ (US);

Georgios Dogiamis, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Essential Patents Group, LLP

Primary Examiner:

Herve-Louis Y Assouman

Assistant Examiner:

Christopher M Roland

Int. Cl.
CPC ...
H01L 23/467 (2006.01); C23C 24/04 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); F28D 1/03 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); C23C 24/04 (2013.01); H01L 21/4882 (2013.01); H01L 23/473 (2013.01); F28D 1/0316 (2013.01); F28D 2021/0029 (2013.01); F28F 2260/02 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); H01L 23/3738 (2013.01);
Abstract

A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.

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Elsherbini, Adel. (2025). Modular microchannel thermal solutions for integrated circuit devices (U.S. Patent No. 12199012). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12199012

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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