The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jun. 18, 2021
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Abstract
A method for predicting the yield of manufacturing semiconductor devices includes steps of: acquiring defect data of semiconductor devices to be predicted, wherein the semiconductor devices to be predicted include finished semiconductor devices and semi-finished semiconductor devices, and the defect data indicates a defect type and location of at least one defect of the semiconductor devices; inputting the defect data into a pre-trained yield prediction model, wherein the yield prediction model includes a neural network structure and a classification structure, the neural network structure is used to extract defect feature vectors from the defect data, and the classification structure is used to output classification results of qualified or unqualified yield according to the defect feature vectors; and determining, by the yield prediction model, classification results of qualified or unqualified yield of the semiconductor devices.